Our Technologies
Ultralight Technology
We have developed a unique technology that enables weight and size reduction of waveguide-based RF components by a factor of 10 to 15. This technology is based on a novel fabrication process to create complex waveguide structures with high precision and accuracy. Our technology also allows for cost-effective scalability and mass production of RF components, which is essential for the emerging market of low earth orbit (LEO) satellite constellations.
Screwless Assembly Technology
In addition, we have invented a “Screwless Assembly Technology” that overcomes the mechanical design constraints of traditional combining methods. This technology enables fast and easy assembly of multi-piece RF components without the need for screws or bolts. This reduces the risk of mechanical failures, improves the electrical performance, and simplifies the integration process. Our screwless assembly technology is suitable for both satellite and ground terminal applications.
Our technologies are eligible for global patents, and they will be secured as core technologies for Metalonn.
Our Innovation
We use a novel technology that reduces the weight of HF components by 10-15 times, which lowers the launch costs for satellites.
Our unique screwless assembly technology that allows us to assemble multiple parts of RF components in a cost-effective and mass-production-friendly way.
Both Technologies makes us capable of mass production which is one of the most important challenges the high frequency components industry is facing due to the many LEO constellations.
We offer a one-stop solution for customers who need high-quality, low-cost, and reliable RF components.